单芯片设计的串行通信方案，引脚少、封装尺寸小，且在同一颗粒上集成了存储阵列和控制器，并带有内部ECC模块，使其在满足数据传输效率的同时，既节约了空间，又提升了稳定性。产品现拥有38nm及2xnm的成熟工艺制程，目前工艺制程已经推进至1xnm先进工艺制程。产品可提供WSON、BGA、LGA多种封装形式、1.8V/3.3V两种电压，不仅在目前日益普及的移动互联网及物联网设备中保持低功耗，也更灵活地适用于不同应用场景。

A single-chip serial interface solution featuring a low pin count and compact package footprint. The memory array and controller are integrated on the same die, with an on-chip ECC module that ensures high data transfer efficiency while saving board space and enhancing system reliability. Available in mature 38nm and 2xnm process nodes, with the latest generation advancing to 1xnm leading-edge process technology. Multiple package options are supported — WSON, BGA, and LGA — along with dual operating voltages of 1.8V and 3.3V, enabling ultra-low power consumption in the increasingly prevalent mobile internet and IoT devices, while offering greater flexibility across diverse application scenarios.